Supply Chain
Uploaded by lilychung on Apr 20, 2002
Introduction
We have identified that any initiative aimed at improving the customer/ supplier relationship supports SCM – this is true from an internal, individual organization perspective through to complex supply chain structures.
Identify at least 1 initiative being implemented (or has been implemented) by your business that supports SCM thinking. For each initiative:
Describe the aims (objectives) of the action being taken and outline the supply chain problem it seeks to address
Outline the proposal (or solution) and describe how it supports SCM principles
Identify any potential barriers to its successful implementation that could hinder the effectiveness of the initiative
1.1 Background information the company
Established in 1980, Possehl BESI Electronic Hong Kong Limited has been famous in the Electronic industry locally and internationally for its’ precision skills and loyalty towards its’ customers. Located in Tsuen Wan, Hong Kong, we are currently employing over 600 staffs; they include Management and Administration officers, engineers, technicians, production operators and security guards, etc.
The parent company of Possehl BESI Electronic Hong Kong Limited is Possehl BESI Electronics N.V. in the Netherlands. It is a joint venture between L. Possehl & Company mbH of Germany (50%), GHL Industries of Asia (25%) and BE Semiconductor Industries of Amsterdam in the Netherlands (25%). This combination has created a company that has been one of the top 10 players in the high-tech electronic semiconductor packaging and equipment sector in the world. In fact, it is the largest non-Japanese supplier in this field since 1992.
Possehl BESI Electronic Hong Kong Limited produce mainly two kind of products, one of them is semiconductor packaging, technically known as punched and etched, high-precision components, such as lead frames, contacts, punched parts, components & subassemblies that are intend to be consumed by the electronic industry.
Lead frames are manufactured from strip metal by means of stamping or etching, and microchips are then mounted on each of these lead frames. The thickness of each frame is no thinner that 0.1 mm. These carriers are vital for turning chip sets into state-of-art electronic components that will later be installed into computers, mobile phones or missiles.
Special required finishing are also available upon request, for example, electroplating full-face and spot technology lead frames or making endless plug-in connectors that can be as small as 0.07mm in width for special purposes.
Other than the semiconductor packaging, Machineries and tools that manufacture lead frames and assemble semiconductors are another major business at Possehl BESI Electronic...